Richardson Electronics' manufacturing facilities offer a wide variety of capabilities for joining various materials, to performing secondary machining operations, and chemical processing in which, make us a vendor of choice for many applications.

Metal Joining


  • Dip Brazing, Aluminum
  • Furnace Brazing
  • Hydrogen Atmosphere
  • Inert Atmosphere
  • Torch Brazing
  • Vacuum Brazing


  • Traditional Gas Torch
  • Heliarc (TIG)
  • Electric Rod (Stick)
  • Spot Welding


  • Bonded Fin Heatsinks
  • Soldering of Electronic Assemblies
  • Solder Dipping

Richardson Electronics is a Certified Member of IPC

Additional Capabilities

  • Glass to Glass Sealing
  • Glass to Metal Sealing
  • Glassblowing
  • Metal to Ceramic Sealing
  • Metal Seal Welding
  • Vacuum Processing

Richardson Electronics' manufacturing facilities are ISO 9001:2008 Certified.